发明名称 |
Holding structure of an electronic component and a method for holding the same |
摘要 |
A holding structure of an electronic component includes a first resin mold formed by resin insert molding with a terminal. The first resin mold possesses a positioning portion for positioning the electronic component to be electrically connected to the terminal. The holding structure includes a second resin mold formed by resin insert molding with the terminal and surrounding the first resin mold and the electronic component. The electronic component has been positioned by the first resin mold and has been electrically connected to the terminal.
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申请公布号 |
US2003121822(A1) |
申请公布日期 |
2003.07.03 |
申请号 |
US20020309121 |
申请日期 |
2002.12.04 |
申请人 |
YASUDA KEIJI;KIMURA MASAHIRO;OKUYA HISAYOSHI;YATA HIDETOSHI;ITO HIROYOSHI;NISHIGUCHI MASAYUKI;MIZUNO NAOKI |
发明人 |
YASUDA KEIJI;KIMURA MASAHIRO;OKUYA HISAYOSHI;YATA HIDETOSHI;ITO HIROYOSHI;NISHIGUCHI MASAYUKI;MIZUNO NAOKI |
分类号 |
G01D5/14;H05K5/00;(IPC1-7):B65D85/00 |
主分类号 |
G01D5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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