Semiconductor device and method for manufacturing the same

摘要

A semiconductor device comprises a semiconductor substrate (24) on which an element (39) is formed and a plug (19a) and a wiring layer (19b) buried in the low dielectric constant insulation film (14) formed over the semiconductor substrate and having a relative dielectric constant of 3 or lower. A high Young's modulus insulation film (16) having a Young's modulus of 15 GPa or higher is formed in contact with the side of the plug between the low dielectric constant insulation film and the plug.