发明名称 Method of depositing heusler alloy thin film by co-sputtering
摘要 A method of manufacturing a Heusler alloy thin film by co-sputtering is provided. The Heusleralloy thin film has a general structure formula X2YZ or XYZ by co-sputtering using a deposition apparatus having a substrate placed on a substrate holder in a chamber and targets positioned on a target bracket spaced apart from the substrate. Components of the Heusler alloy thin film are placed on the target bracket as one of single targets and binary alloy targets. Thus, it is easy to manufacture a Heusler alloy thin film having excellent magnetic characteristics. <IMAGE>
申请公布号 EP1318208(A3) 申请公布日期 2003.07.02
申请号 EP20020255286 申请日期 2002.07.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KEE-WON;PARK, WAN-JUN;KIM, TAE-WAN;SONG, I-HUN;PARK, SANG-JIN
分类号 H01L21/203;C22C9/00;C22C9/01;C22C9/02;C22C9/05;C22C9/10;C22C19/07;C23C14/14;C23C14/34;C30B23/02;G11B5/851;H01F41/18 主分类号 H01L21/203
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