APPARATUS AND METHOD FOR AN INTEGRATED CIRCUIT HAVING HIGH Q REACTIVE COMPONENTS

摘要

IN AN IC PACKAGING SCHEME, A MULTILAYER SUBSTRATE (822) IS COMPOSED OF ELECTRICALLY CONDUCTIVE LAYERS (824 & 826) OF INTERCONNECTS (840 -810), SEPARATED BY INSULATIVE LAYERS OF EPOXY RESIN OR CERAMIC AND CONNECTED BY VIAS (850 -854). PASSIVE ELEMENTS ARE INTEGRATED WITHIN THE SUBSTRATE AT THE DEFINITION STAGE DURING LAYOUT OF THE INTERCONNECTS (840 -810). THE PASSIVES CAN BE USED TO ENHANCE THE ELECTRICAL PERFORMANCE OF THE ACTIVE CIRCUIT DIE TO A MAXIMUM EXTENT ALLOWED BY THE MATERIAL TECHNOLOGY USED FOR THE SUBSTRATE. MATERIAL SELECTION FOR THE PACKAGE IS MADE TO ALLOW FOR THE BEST PASSIVE INTEGRATION FOR A GIVEN CIRCUIT DESIGN. TYPICAL APPLICATIONS INCLUDE POWER SUPPLY BYPASS CAPACITORS, RADIO FREQUENCY TUNING, AND IMPEDANCE MATCHING. THE INCORPORATION OF PASSIVES IN THE PACKAGING SUBSTRATE CREATES A NEW CLASS OF ELECTRICALLY TAILORABLE PACKAGING THAT CAN DERIVE IMPROVED PERFORMANCE FOR ANY GIVEN DIE DESIGN OVER EXISTING APPROACHES. (FIGURE 8)