发明名称 INTERPOSER ASSEMBLY FOR SOLDERED ELECTRICAL CONNECTIONS
摘要 An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts in the passages. The contacts have resilient upper and lower contact arms that deflect into upper and lower recesses of the plate when sandwiched between contact pads of overlying and underlying circuit members. The recesses are sized to accommodate solder connections between contact arms and contact pads.
申请公布号 AU2002366492(A1) 申请公布日期 2003.06.30
申请号 AU20020366492 申请日期 2002.11.13
申请人 INTERCON SYSTEMS, INC. 发明人 DOUGLAS, A. NEIDICH;DONALD, W., JR. MILBRAND
分类号 H01L23/32;H01R12/04;H01R13/24;(IPC1-7):H01R12/22 主分类号 H01L23/32
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