| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin wiring board having signal conductor wires for transmitting a high frequency signal in which transmission characteristics of signal can be enhanced. <P>SOLUTION: The resin wiring board 101 comprises a substrate body 111 having a substrate major surface 112 and a substrate rear surface 113. The substrate body 111 comprises a major surface side resin insulation layer 131 and signal conductor wires 141 and 142 for transmitting a high frequency signal of 200 Mb/sec or above are formed on the surface thereof. The signal conductor wire 141, 142 has one end provided with a component connection part 141S, 142S exposed to the substrate major surface 112 and connected with the terminal of an IC chip 171 and the other end provided with an external connection part 141T, 142T exposed to the substrate major surface 112. <P>COPYRIGHT: (C)2003,JPO |
