发明名称 FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a structure of a flexible circuit board, together with its manufacturing method, for finding the fact that trimming is not completed or insufficient. SOLUTION: A conductive layer is provided on an insulating sheet of a flexible material, and a circuit pattern is formed on the conductive layer. A trimming mark 12 indicating completion of a trimming process is provided on a section 10B of a flexible circuit board 10 except for a section 10A where the circuit pattern is formed. In the method for manufacturing the flexible circuit board, the circuit pattern is formed on the substrate where the conductive layer is formed on the flexible insulating sheet, and drilling or other trimming process is performed at the part required for forming a circuit on the board. A trimming mark indicating completion of the trimming process is trimmed at a part not required for forming the circuit board. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179319(A) 申请公布日期 2003.06.27
申请号 JP20010378646 申请日期 2001.12.12
申请人 NIPPON MEKTRON LTD 发明人 KANEKAWA MASAAKI
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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