| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball mounting apparatus which is so designed to precisely control the number of solder balls in a solder ball container within a prescribed range. SOLUTION: The solder ball mounting apparatus comprises a container 2 for storing a plurality of solder balls 1; a counter 69 which measures the total floating time of the solder balls 1 by counting clock signals from an oscillator 67 only while reflected light from the solder balls 1 floating in the container 2 is received by a light blocking sensor 66; and a calculating means 70 which calculates the number of the solder balls 1 in the container 2 based on the measurement result of the counter 69. From the correlation between the total floating time and the number of the solder balls, the number of the solder balls 1 in the container 2 can be precisely controlled, increasing the productivity. COPYRIGHT: (C)2003,JPO
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