| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for electrical tests capable of facilitating the tests of a semiconductor device and a wiring circuit board or the like having a high-density hyperfine wiring pattern. SOLUTION: This wiring board for electrical tests is manufactured by a method including the step for forming wiring having a prescribed pattern on a conductive temporary substrate such as an elongated copper foil, the step for laminating the wiring and a resin, a process for burying the wiring into an insulating substrate, a process for removing a part of the conductive temporary substrate excepting a part of the temporary substrate, namely, a spot to become a projecting electrode to be brought into contact with an electrode of a test device, and the step for coating with an insulating layer the wiring having the prescribed pattern excepting the part of the projecting electrode, if necessary. COPYRIGHT: (C)2003,JPO
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