发明名称 COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To shorten a time required for mounting components. <P>SOLUTION: Types of components common to printed wiring boards A and B are determined in a preparatory operation W1 from a time T0 to a time T1. Then, a mounting unit is stopped, and a preparatory operation W2 related to the printed wiring boards A and B is carried out from a time T1 to a time T2. Concretely, program data are loaded, components are set on a mounting unit, and an ambient temperature is measured. When the components are set on the mounting unit, both exclusive types and common types of components are set on the printed wiring board A and B, respectively. As mounting operation W3 for the printed wiring board A is carried out from a time T2 to a time T3, and the components are arranged at the prescribed positions on the printed wiring board A in accordance with the loaded program data. The mounting unit is temporarily stopped, and some preparatory operations W4 such as the measurement of temperature and the like are carried out from a time T3 to a time T4. Thereafter, a mounting operation W5 for the printed wiring board B is carried out from a time T4 to a time T5. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179398(A) 申请公布日期 2003.06.27
申请号 JP20010376941 申请日期 2001.12.11
申请人 SONY CORP 发明人 MIYAMOTO MASAHIRO;MORITA TETSUJI;MASE MIKIKO;OTANI YUZO
分类号 H05K13/04 主分类号 H05K13/04
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