| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method and packaging method of a semiconductor device in which generation of resin burrs is avoided at the time of molding and occurrence of cracking due to soldering is prevented. SOLUTION: The production method of a semiconductor device comprises a step for bonding a plurality of leads to the upper surface of a semiconductor chip where a plurality of electrodes are formed through an insulating adhesive layer, a step for connecting the leads electrically with the electrodes by a connecting means, a step for holding the semiconductor chip by means of upper and lower dies such that the rear surface of the semiconductor chip abuts against the lower die and the leads abut against the upper die on the side opposite to the part bonded through the adhesive layer, and a step for injecting resin into a cavity defined by the upper and lower dies. The semiconductor device is mounted on a packaging substrate such that a sealing resin formed on the surface side of the semiconductor chip in a produced semiconductor device touches the packaging substrate. COPYRIGHT: (C)2003,JPO
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