| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemically amplified positive resist applicable to both a process using an antireflection film and a process not using the film, excellent in resist pattern shape, sensitivity, focal depth-width quality and post-exposure temporal stability and having no substrate dependence. <P>SOLUTION: In a positive resist composition comprising (A) a resin component having solubility in an alkaline aqueous solution increased by the action of an acid and (B) a compound which generates an acid upon irradiation with a radiation, the component (B) is a mixture of (b<SB>1</SB>) cyano-containing oximesulfonate compounds and (b<SB>2</SB>) bissulfonyldiazomethanes and/or onium salts. <P>COPYRIGHT: (C)2003,JPO |
