| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist pattern forming method capable of simultaneously suppressing a PED phenomenon due to contaminants in the air and a PED phenomenon due to diffusion of an acid or a base in a protective film into a layer of a resist. <P>SOLUTION: During the time from at least the end of exposure to the commencement of heat treatment, a protective film 15 containing a photobase is kept on a layer 13 of a chemically amplified resist when the layer 13 is an acid catalyst type one, and a protective film 15 containing a photoacid is kept on the layer 13 when the layer 13 is a base catalyst type one, and a required resist pattern is formed in the layer 13. <P>COPYRIGHT: (C)2003,JPO |
