| 摘要 |
<p>A method including in a wafer processing environment, introducing a liquid (416) via a carrier gas, and separate from the liquid, introducing a first gas comprising ozone and a legacy amount of oxygen (420) and a second gas comprising an effective amount of oxygen (430) to modify a process operation. A system including a chamber, a liquid source, a first gas source, and a second gas source, a controller configured to control the introduction into the chamber of a liquid from the liquid source, a first gas comprising ozone and a legacy amount of oxygen from the first gas source, a second gas comprising oxygen from the second gas source.</p> |
