发明名称 Electric-component mounting system, and printed-circuit board fabricating process
摘要 An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a selected one of the electric components while each mounting unit is located in a component-supplying area, and to mount the electric component onto the at least one circuit substrate held by the substrate-holding device located in a component-mounting area, and a mounting-unit moving device operable to move the at least one first mounting unit and the at least one second mounting unit past each other, between the component-supplying and component-mounting areas in opposite directions, along respective two paths, without an interference between the first mounting unit and second mounting units.
申请公布号 US2003116339(A1) 申请公布日期 2003.06.26
申请号 US20020200291 申请日期 2002.07.23
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 SUHARA SHINSUKE
分类号 H05K13/02;(IPC1-7):H05K5/00 主分类号 H05K13/02
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