TEST SYSTEMS FOR WIRELESS-COMMUNICATIONS DEVICES

摘要

Wireless communications devices, such as mobile telephones and pagers, typically include a multi-tiered electronic assembly. Conventional testing of these multi-tiered assemblies in not only slow and wasteful, but sometimes requires the assemblies to include extra ground contacts that can disrupt normal circuit operation. Accordingly, the present inventors have devised unique test probes and related systems and methods for testing these electronic assemblies. One unique probe structure includes at least one signal contact surface (122) for contacting a signal-port trace (611) of an electronic assembly and at least one substantially larger ground contact surface (166.2.) for contacting a ground pad (614) of the electronic assembly. In another, the ground probe (160) has a contact surface (166.2) and a non-contact surface (166.1) for overhanging a portion of a signal-port trace (611) and thereby establishing a desired characteristic impedance. These and other presented probe structures facilitate more rapid and cost-effective testing of electronic assemblies.