| 摘要 |
PURPOSE: A method for manufacturing a microstrip is provided to prevent the generation of contamination and improve the accuracy by omitting an etching process. CONSTITUTION: A conductive layer and a nonconductive layer are alternatively and repeatedly stacked to form a stacked body. The stacked body is divided into four pieces in a predetermined size. Dividing the stacked body results in the reduction of the number of processes and the improved productivity. The cut stacked bodies are re-stacked. A lateral of the re-stacked body is cut in the form of a thin sheet. The conductive layer of the thin sheet functions as a wire and the nonconductive layer acts as a connector for connecting the wire. The thin sheet, i.e., a microstrip sheet, is polished. The polished microstrip sheet is attached to a PCB(Printed Circuit Board) or a semiconductor chip.
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