发明名称 BUMPER PANEL MOLD STRUCTURE FOR VEHICLE
摘要 PURPOSE: A bumper panel mold structure for a vehicle is provided to improve assembly efficiency and the appearance of products by separating the upper part of an undercut treating block from the undercut treating block and keeping the size of an undercut hole. CONSTITUTION: In a bumper panel mold structure including a fixed mold and a movable mold(20), an undercut treating block(21) is engaged with the movable mold, and forms an undercut(23) at a bumper panel. The undercut treating block is separated from an undercut hole part, and moves vertically.
申请公布号 KR20030048706(A) 申请公布日期 2003.06.25
申请号 KR20010078689 申请日期 2001.12.12
申请人 HYUNDAI MOTOR COMPANY 发明人 LEE, DU GYUN
分类号 B29C45/44;(IPC1-7):B29C45/44 主分类号 B29C45/44
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