BARREL PLATING APPARATUS AND BARREL PLATING METHOD

摘要

PURPOSE: A barrel plating apparatus and a barrel plating method are provided to greatly reduce twin chip of any types of small chip component by installing an ultrasonic generator at barrel plating tank and using pulse power supply so that ultrasonic waves and pulse current are periodically alternately generated during barrel plating. CONSTITUTION: The barrel plating apparatus comprises a plating tank(110) in which electrolyte is stored; a barrel main body(130) rotationally arranged inside the plating tank; anodes(122a,122b) arranged inside the plating tank and consisted of the same material as ions contained in the electrolyte; power supply part(120) for supplying pulse current through the cathode connected between the anodes and barrel main body; an ultrasonic wave generation part(140) for supplying certain ultrasonic waves into the plating tank; and a control part(150) for electrically controlling the power supply part and ultrasonic wave generation part so that pulse current and ultrasonic waves are periodically alternately generated, wherein the ultrasonic wave generation part generates ultrasonic waves having a frequency of about 20 to 60 kHz, the periodically alternately generated pulse current and ultrasonic waves are controlled to on-time that is at least longer than one revolution time of the barrel main body in the control part, and the control part is controlled so that both the ultrasonic waves and pulse current are off for a certain period of time when the pulse current and ultrasonic waves are alternately generated.