ELECTRONIC COMPONENT AND MANUFACTURING PROCESS THEREFOR

摘要

PURPOSE: To form desired plated films only on desired parts at a low cost. CONSTITUTION: When a plurality of Zn fragments with an average diameter of 1 mm having an electrochemically poorer resting potential compared to the deposition potential of Ni are mixed with a substrate to be plated in a plating bath, Zn is dissolved and electrons are released. This shifts the potential of a Cu electrode in contact with Zn to a poorer potential, which allows the deposition of Ni on the electrode to form an Ni coating film 3 on the surface of the electrode. Similarly, when Zn fragments are soaked in a tin-plating bath, Zn is dissolved and electrons are released. This shifts the potential of the Ni coating film 3 in contact with Zn to a poorer potential, allowing the deposition of Sn on the Ni coating film 3 to form an Sn coating film 4.