| 发明名称 |
Sheet-framed IC carrier and method for producing the same |
| 摘要 |
A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.
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| 申请公布号 |
US6581840(B2) |
申请公布日期 |
2003.06.24 |
| 申请号 |
US20010967973 |
申请日期 |
2001.10.02 |
| 申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
TAKEDA MITSUNORI;IGARASHI EIICHI;YOSHIDA HIDEYO |
| 分类号 |
B42D15/10;G06K19/077;(IPC1-7):G06K19/02 |
主分类号 |
B42D15/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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