| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film having high elastic modulus, excellent in alkali-etching property, flexibility, low moisture expansion coefficient, thermal dimensional stability and film forming property when the polyimide film is applied to a base for a flexible printed circuit for high precision comprising a metallic wiring on the surface, a CSP, a COF, a BGA or a TAB tape (Tape automated bonding), and to provide a method for producing the same and to provide a metallic wiring board using the same as a base. SOLUTION: The polyimide is produced from a random, block or mixed polyamic acid which comprises at least a pyromellitic acid anhydride, 3,4'- oxydianiline and 4,4'-oxydianiline and contains 5-50 mol.% of 3,4'-oxydianiline based on diamine, and the polyimide film manifests 4.0-6.5 [GPa] of Young's modulus. COPYRIGHT: (C)2003,JPO |
