| 摘要 |
PURPOSE: Provided is an improved polishing method and apparatus wherein it is possible to achieve polishing of a workpiece and then to achieve washing and drying of the workpiece. CONSTITUTION: A polishing apparatus has a center robot(10) having arms(10-1,10-2) at a central part thereof. Around the center robot(10) and in an area that can be accessed by the arm, there are a loading unit(11), an unloading unit(12), polishing units(13,14), a washing unit(15), and auxiliary spaces(18,19) for accommodating additional units, in a hexagonal arrangement. Thickness meters for measuring a thickness of the semiconductor wafer are installed in the auxiliary spaces(18,19).
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