| 摘要 |
A semiconductor chip is secured on a die-pad which has been depressed. One end of a tie-bar is combined with the die-pad. One of a lead is connected to the semiconductor chip by, for example, a bonding wire. A molded resin block covers up the die-pad, semiconductor chip and lead, and has an upper surface, a lower surface and sides. The other end of the tie-bar and the other end of the lead are exposed at the lower surface of the resin block. The surfaces of the tie-bar and lead, which are exposed, lie in substantially the same plane as at least the lower surface of the resin block. The lower surface of the die-pad may be exposed at the upper surface of the resin block, and the lower surface of the die-pad, which is exposed outside the resin block, may be set in substantially the same plane as the upper surface of the resin block. |
