| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a polyimide precursor having ethylenically unsaturated double bonds that are reactive under an active ray such as UV in side chains, developable with an aqueous alkali solution and having negative pattern forming ability. <P>SOLUTION: The photosensitive resin composition comprises a solvent containing (A) a polyimide precursor of formula (1) (where each R<SP>1</SP>is a tetravalent aromatic group or a tetravalent organic group formed by bonding a plurality of aromatic rings through a single bond, -O-, -CO-, -SO<SB>2</SB>- or -CH<SB>2</SB>-; each R<SP>2</SP>is a divalent aromatic group or a divalent organic group formed by bonding a plurality of aromatic rings through a single bond, -O-, -CO-, -SO<SB>2</SB>- or -CH<SB>2</SB>-; and each R<SP>3</SP>is an organic group having an ethylenically unsaturated bond represented by formula (2) wherein 1 is an integer of 1-3), (B) a photopolymerization initiator, a sensitizer and a polymerization inhibitor and (C) a photosensitive agent. A method for producing the photosensitive resin composition is provided. <P>COPYRIGHT: (C)2003,JPO |
