| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate holding device which can polish in correspondence to a film thickness distribution of a thin film formed on a surface of an object to be polished such as a semiconductor wafer or the like and can obtain uniformity of the film thickness after polished, and to provide a polishing device. <P>SOLUTION: A substrate holding device holds a semiconductor wafer W as an object to be polished and presses it to a polishing surface. The substrate holding device comprises a top ring main body 2 internally having an accommodating space and a chucking plate 6 vertically movable in the accommodating space of the top ring main body 2. A ring tube 9 formed with an elastic film 91 so as to abut against directly or indirectly the semiconductor wafer W is fit on a lower surface of the chucking plate 6, and the chucking plate 6 is formed with a material having high rigidity. <P>COPYRIGHT: (C)2003,JPO |
