| 摘要 |
PROBLEM TO BE SOLVED: To shorten the working time of inch conversion work for implanting ions into wafers having different outside diameter by eliminating the work for replacing an arm wafer receiver. SOLUTION: First arm wafer receivers 26 and 27 are provided, respectively, with a plurality of carry-in side recesses 26a, 27a, 26b and 27b capable of containing a plurality of kinds of wafer 11 of different diameter and having inside diameters corresponding to the outside diameter of these wafers. Second arm wafer susceptor 28 and 29 are provided, respectively, with a plurality of carry-out side recesses 28a, 29a, 28b and 29b capable of containing a plurality of kinds of wafer of different diameter and having inside diameters corresponding to the outside diameter of these wafers. Bottom face of the plurality of carry-in side recesses is formed to become lower sequentially stepwise from the outside toward the inside and the bottom face of the plurality of carry-out side recesses is formed to become lower sequentially stepwise from the outside toward the inside. COPYRIGHT: (C)2003,JPO |
