| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which has realized further reduction of thickness and reduced stress to be applied to a lead member within the sealing resin, and also to provide a method of manufacturing the same semiconductor device. <P>SOLUTION: The resin-sealed semiconductor device comprises a die pad 2 including thin lower portion of the lead frame, a semiconductor chip 1 mounted on the die pad 2, a plurality of leads 3 including thin upper portion of the lead frame, connecting members 4 to connect the semiconductor chip and the leads 3, a plurality of handing leads 8 connected to the die pad 2, and sealing resin to seal the upper portion of the lead frame. Therefore, while the die pad 2 is being upset, the resin-sealing semiconductor device realizes further reduction of thickness. Moreover, stress by resin sealing is absorbed due to self-bending deformation of the die pad 2 and leads 3 reduced in the thickness. As a result, reliability of connection can be improved. <P>COPYRIGHT: (C)2003,JPO |
