| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of a leadless surface-mount type, which is highly precise, small-size, thin, and in addition highly reliable. <P>SOLUTION: This semiconductor device comprises a metal layer 2a on which a semiconductor element S is mounted, one or more electrode layers 2b arranged around the metal layer 2a at specified intervals, bonding wires or the like that electrically connect the semiconductor element S mounted on the metal layer 2a and the electrode layers 2b, and a resin layer 4 that seals the members above described, wherein the backside surface of the metal layer 2a and of the electrode layers 2b are exposed on the bottom face of the resin layer 4. A biting effect into the resin layer 4 brought by adopting an overhang-like protruding structure to each upper-end peripheral part of the metal layer 2a and the electrode layers 2b to be resin-sealed enhances the adhering strength. <P>COPYRIGHT: (C)2003,JPO |
