THIN-FILM FORMING APPARATUS AND THIN-FILM FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thin-film forming apparatus and a thin-film forming method whereby a thin film can be preferably transferred to a substrate. SOLUTION: Before starting transfer of an insulating film 81 to a substrate W, a degree of vacuum is lowered by reducing an opening of a butterfly valve 21, so that volatilization of solvent components is reduced on the insulating film 81 and flowability of the insulating film 81 is ensured at the start of transfer. On the other hand, the butterfly valve 21 is fully opened from the start of transfer to rapidly reduce the pressure in a thin-film forming chamber 11, and the insulating film 81 is transferred to the substrate W at a low pressure (high degree of vacuum) all the time. COPYRIGHT: (C)2003,JPO