| 摘要 |
The invention relates to a module for a testing device which tests printed circuit boards, comprising a plurality of contact points arranged in a strip-shaped section of a testing plane and an electronic unit forming at least one part of an electronic evaluation system which is used to evaluate the testing signal, said electronic unit being disposed in the area below the strip-shaped section, forming a structural unit with the contact points. The contact points are arranged in a grid-like structure at a distance of not more than 2 mm and at least two contact points are electrically connected to each other. The electrically connected contact points are connected respectively to an input of the electronic unit. The aim of the invention is to provide a module which can be used to produce a low-cost, basic grid-like structure with high density contact points. |
