发明名称 SYSTEM FOR TREATING SUBSTRATE AND SUBSTRATE DRYER
摘要 <p>A horizontal carriage type substrate treating system where a substrate is carried in the horizontal direction and subjected to wet treatment and a section for cutting liquid by means of an air knife is provided on the downstream side of the wet treatment section. In the substrate treating system, the substrate is supported stably in the vicinity of an inclining air knife slit nozzle (62) and complication of a substrate carrying mechanism is avoided. For that purpose, a large number of free rollers (67A, 67B) for supporting the substrate are distributed in spaces including right triangular dead spaces formed on the upstream side and downstream side of the slit nozzle (62) when it is inclined. Specified number of free rollers (67A, 67B) are placed collectively on shared supporting plates (64A, 64B) disposed on the upstream side and downstream side of the slit nozzle (62).</p>
申请公布号 WO2003050601(P1) 申请公布日期 2003.06.19
申请号 JP2001010961 申请日期 2001.12.13
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