| 摘要 |
A pressing kit for substrate or lead frame of a semiconductor packaging. The kit comprises a box body and a press block, wherein the box body is a hollow metallic body having a U-shaped lead board at the two lateral sides thereof. The bottom face of the inner side of the U-shaped lead board is provided with a blocking block for the holding of a bottom board. The pressing block is an elongated block body of similar length to the inner side of the box body, and the top face is provided with four pillar holes. The circular slot on the top of the pillar hole is inserted with a screw bolt from the top thereof, and a compression spring is placed at the wider recess at the bottom section.
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