发明名称 |
Method for connection of circuit units |
摘要 |
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
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申请公布号 |
US2003110628(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20020298837 |
申请日期 |
2002.11.18 |
申请人 |
FRANKOWSKY GERD;HEDLER HARRY;IRSIGLER ROLAND;MEYER THORSTEN;VASQUEZ BARBARA |
发明人 |
FRANKOWSKY GERD;HEDLER HARRY;IRSIGLER ROLAND;MEYER THORSTEN;VASQUEZ BARBARA |
分类号 |
H01L21/00;H01L21/60;H01L21/78;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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