发明名称 |
Contact for ball grid array connector |
摘要 |
A contact for being received in an electrical socket which interconnects an integrated circuit (IC) package with a printed circuit board (PCB), comprises a contact portion for electrically connecting with a pin of the IC package, a locating portion for interferentially engaging with insulative housing of the electrical socket, and a tail portion having a plurality of clip arms. When a solder block is inserted into the tail portion, the clip arms can deflect to secure the solder block in a predetermined position in the tail portion.
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申请公布号 |
US2003114029(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20010020567 |
申请日期 |
2001.12.14 |
申请人 |
LEE GENN-SHENG;SZU MING-LUN |
发明人 |
LEE GENN-SHENG;SZU MING-LUN |
分类号 |
H01R4/02;H01R12/57;H01R43/02;H05K3/34;(IPC1-7):H01R12/00;H05K1/00 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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