TAPE CIRCUIT BOARD FOR COF PACKAGE HAVING COGNITIVE MARK

摘要

PURPOSE: A tape circuit board for COF(Chip On Film) having a cognitive mark is provided to reduce a coating error of a cognitive mark in an adhering process of a semiconductor chip by forming the cognitive mark at a corresponding position apart from the outside of a solder resist boundary. CONSTITUTION: A tape circuit board includes an insulating layer(210), a circuit pattern(220), and a solder resist forming layer(240). The circuit pattern is formed on one side of the insulating layer. The circuit pattern includes a lead pattern(222) and a cognitive mark(223). The solder resist layer is used for exposing a part of the insulating layer, a part of the lead pattern, and the cognitive mark. The cognitive mark is formed at a corresponding position of 1000 or more micrometers apart from the outside of a solder resist boundary portion among the solder resist forming layer, the exposed lead pattern, and a dummy lead.