SURFACE ACOUSTIC WAVE FILTER CHIP PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A surface acoustic wave filter chip package and a fabricating method thereof are provided to prevent the permeation of the resin by forming an internal dam structure according to a shape of an internal region of a conductive pattern. CONSTITUTION: A conductive pattern(33) is formed on an upper surface of a substrate(31). The first dam structure(38) is formed on the inside region of the conductive pattern formed on the upper surface of the substrate. A plurality of bumps(37) are formed at a lower end side of a surface acoustic wave filter chip(35). The second dam structure(39) is formed at the lower end side of the surface acoustic wave filter chip corresponding to the outside of the bumps. The surface acoustic wave filter chip is mounted on the substrate by connecting the conductive pattern with the bumps. A resin material(40) is coated on the surface acoustic wave filter chip.