SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: To obtain a semiconductor integrated circuit device in which bonding wires can be connected easily and surely between pads and leads. CONSTITUTION: This semiconductor integrated circuit device has two semiconductor integrated circuit chips 20 and 30 respectively provided with pluralities of pads 40a-40e, 41a-41e and 42a-42d, a plurality of leads 50a-50d arranged around the array of the semiconductor integrated circuit chips 20 and 30, and a plurality of bonding wires 60a-60e and 61a-61d. The bonding wires 60a-60e and 61a-61d are respectively connected between the pads 40a-40e of the chip 20 and the pads 41a-41e of the chip and between the pads 42a-42d of the chip 30 and the leads 50a-50d without crossing over the chip 30 so that the pads 40a-40e of the chip 20 may be connected to the leads 50a-50d.