| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC chip fitting method capable of temporarily fitting IC chips to a gripping part irrespective of a position of the IC chip and suction force, and fitting the IC chips to an article to be fitted surely and accurately, and a packaging material fitted with IC chips manufactured by using the non-contact IC chip fitting method. <P>SOLUTION: In a method for fitting IC chips capable of reading or reading/ writing data in a non-contact manner, the IC chips (11) are temporarily fitted to an article (12) by static electricity caused by charging the IC chips to the positive or negative charges. <P>COPYRIGHT: (C)2003,JPO |
