| 摘要 |
A method and apparatus are provided for constructing a temperature controlled crystal oscillator chip. The method includes the steps of disposing a connection pad on a surface of the chip, providing a first circuit within the chip for control of a first chip function through a first interconnection with the connection pad and providing a second circuit within the chip for control of a second chip function, unrelated to the first chip function, through a second interconnection with the connection pad.
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