发明名称 Semiconductor manufacturing apparatus and device manufacturing method
摘要 Wafers are sequentially loaded, exposed, and unloaded. When a wafer exposed or being exposed is to be recovered in a carrier in a predetermined case, a storage section stores information for specifying the slot of the carrier in which the recovered wafer is stored and information associated with the wafer in correspondence with each other. When the wafer recovered is the first wafer recovered in the lot to which the wafer belongs, and a wafer is already present in the carrier, a new carrier is set in place of the wafer in accordance with an output, and the wafer is recovered in the new carrier.
申请公布号 US6580958(B1) 申请公布日期 2003.06.17
申请号 US19990444515 申请日期 1999.11.22
申请人 CANON KABUSHIKI KAISHA 发明人 TAKANO SHIN
分类号 H01L21/027;H01L21/00;(IPC1-7):G06F19/00 主分类号 H01L21/027
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