发明名称 Method for fabricating an open can-type stacked capacitor on an uneven surface
摘要 An open can-type stacked capacitor is fabricated by forming a conductive layer (30, 130) outwardly of a substantially uneven surface (12, 112). A step (50, 150) is formed in an outer surface (32, 132) of the conductive layer (30, 130). A base (72, 172, 202) of a first electrode (70, 170, 200) is formed by removing a predetermined thickness (66, 166) of at least part of the conductive layer (30, 130). The base (72, 172, 202) is made of a portion of the conductive layer (30, 130) underlying the step (50, 150) by the predetermined thickness (66, 166). A sidewall (74, 174) of the first electrode (70, 170, 200) is formed. A dielectric layer (80) is formed outwardly of the first electrode (70, 170, 200). A second electrode (82) of the capacitor is formed outwardly of the dielectric layer (80).
申请公布号 US6580112(B2) 申请公布日期 2003.06.17
申请号 US20010855401 申请日期 2001.05.15
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 MIYAI YOICHI;MOROI MASAYUKI;BOKU KATSUSHI;NAGATA TOSHIYUKI
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L21/02
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