| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a carrying method in which the generation of dust is prevented at the time of carrying a lead frame and troubles due to the warp of a lead frame are eliminated. SOLUTION: The semiconductor manufacturing device having at least two stages 10 performing the specified processing of a lead frame 2 carried thereto comprises a means 11 movable in the direction orthogonal to a stage plane and holding a lead frame at a specified position of the stage under a state subjected to warp correction, a means 20 for clamping the lead frame by a pair of clamping pieces 22 and 23 provided so as to move along a specified axis, and a means 30 for moving the clamping means 20 between respective stages 10. COPYRIGHT: (C)2003,JPO |
