| 摘要 |
PROBLEM TO BE SOLVED: To increase a degree of freedom on design. SOLUTION: A resistor film 21 composed of a nickel-phosphor alloy is formed by plating on a surface of a substrate 11 as indicated in (a), and a copper plating film 22 is formed on the resistor film 21 by performing electroless copper plating and electrolytic copper plating as indicated in (b). As indicated in (c), after forming a patterned etching resist film (not shown in the figure) on the copper plating film 22, the copper plating film 22 is selectively etched and the etching resist film is removed. The resistor film 21 is selectively etched with the copper plating film 22 as etching resist as indicated in (d), and the copper plating film 22 is selectively etched as indicated in (e). Thus, a resistor 12 is formed and wiring 13 connected to both sides of the resistor is formed. COPYRIGHT: (C)2003,JPO
|
