| 摘要 |
The invention concerns a convection-phase equipment for reflow soldering of electronic components on electronic cards (1) comprising a furnace (10) divided into convection-phase chambers wherein the temperature is different from one chamber to another and defined in accordance with a theoretical temperature profile to be observed, each electronic card passing through the furnace from one end to the other driven by driving means (14-1, 14-2, 14-3) so as to observe the temperature profile.
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