| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer support member which is equipped with an electrostatic chuck whose mounting surface is hardly undulated even if it is subjected to polishing after the electrostatic chuck and a base member are bonded together and can be used for a long term without deforming the electrostatic chuck even if it undergoes heat cycles. <P>SOLUTION: An electrostatic chuck 5 is composed of a ceramic plate 2 whose one main surface is made to serve as a mounting surface 3 where a wafer W is mounted, electrostatic attraction electrodes 4a and 4b provided on the other main surface of the ceramic plate 2, and through-holes for feeding gas to the peripheral edge of the mounting surface 3. A base member 6 is provided with through-holes at its periphery to feed gas. A soft adhesive agent layer having an elongation percentage of 50 or above after it is cured is applied between the bonded surfaces of the electrostatic chuck 5 and the base member 6 including the through-holes, a hard adhesive agent having viscosity of 50 Pa s or below and Shore hardness (D) of 50 or above after it is cured is injected around the soft adhesive agent layer after it is half cured, and then both the adhesive agent layers are completely cured for the formation of a wafer support member 1. <P>COPYRIGHT: (C)2003,JPO</p> |
