LEAD FREE SOLDER COMPOSITION FOR HIGH TEMPERATURE USE WITH GOOD SOLDERABILITY

摘要

PURPOSE: A lead free solder for high temperature use with good solderability and wettability, which exhibits excellent mechanical strength and thermal fatigue resistance even over high temperature conditions. CONSTITUTION: The lead free solder composition comprises Sn 89.5 to 96.4 wt.%; Sb 2 to 4 wt.%; Cu 1 to 3 wt.%; Al 0.1 to 2 wt.%; Ag 0.5 to 1.5 wt.%; and Ga 0.001 to 1 wt.%. The solid phase temperature of the lead free solder is regulated to be within 235 and 243 deg.C to maintain high strength even over high temperature range.