发明名称 |
Method and apparatus for cleaning substrates |
摘要 |
An ultrasonic vibrating apparatus and an ultrasonic cleaning apparatus capable of permitting ultrasonic cleaning of a wafer to be carried out using an existing cleaning tank and while keeping the object immersed in cleaning liquid. An ultrasonic wave is irradiated to a cleaned object while keeping it immersed in cleaning liquid stored in a cleaning tank formed with an upper opening. A vibrating plate is securely mounted thereon with an ultrasonic transducer through a wave transmission element and arranged so as to close the upper opening of the cleaning tank in a cover-like manner. The vibrating plate is so arranged that a vibrating surface thereof downwardly faces and is immersed in the cleaning liquid.
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申请公布号 |
US2003106566(A1) |
申请公布日期 |
2003.06.12 |
申请号 |
US20020159804 |
申请日期 |
2002.05.30 |
申请人 |
PACIFIC INTERNATIONAL STG, INC.;KAIJO CORPORATION |
发明人 |
DANESE MICHAEL J.;TAKAHASHI NORIHISA;TAKAHASHI SEIGO |
分类号 |
B06B1/02;B06B3/04;B08B3/12;G11B23/50;H01L21/00;H01L21/304;(IPC1-7):C25F1/00 |
主分类号 |
B06B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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