WET ETCH EQUIPMENT INCLUDING FINAL RINSE BATH

摘要

PURPOSE: Wet etch equipment including a final rinse bath is provided to perform a final rinse process and maintain high resistivity by forming a natural up-flow of a rinse solution in the final rinse process while including introduction holes in a wafer loading part and a peripheral part. CONSTITUTION: A corresponding semiconductor wafer is settled in the wafer loading part(301) to rinse the semiconductor wafer. A peripheral introduction holes(302) introduce the rinse solution for rinsing the edge of the wafer. A wafer loading introduction holes(303) rinse the wafer and are located in a portion under the wafer loading part. A final rinse bath(300) includes the wafer loading part, the introduction holes in the peripheral part and the introduction holes in the loading part. The upper portions of the introduction holes in the peripheral part and the loading part are tapered. One row of the introduction holes in the loading part and the peripheral part is disposed in a zigzag pattern capable of regarding an adjacent row of the introduction holes in the loading part and the peripheral part.