Production of carriers comprising a base plate and a bottom plate, especially microtiter plates or microsystem chips, comprises using the same adhesive to bond the plates and coat the wells

摘要

Production of a carrier comprising a base plate (2) and a bottom plate (3), where the base plate has openings and is wetted with adhesive, comprises contacting the base plate with the bottom plate so that setting of the adhesive results in an adhesive bond (6) between the plates and a coating (5) over the inside walls of the openings. An Independent claim is also included for a carrier comprising a base plate with openings closed by a base plate to form sample-receiving wells, where the inside walls of the wells are coated with the adhesive used to bond the plates together.